The Interflux® no-clean solderpase, suitable for squeegee printing, cassette printing and dispensing
SOLDER PASTE
The Interflux® no-clean solderpase, suitable for squeegee printing, cassette printing and dispensing
* LEAD FREE:
IF 9008
* ICT-PROOF
IF 9006 series
* EASY USE / WIDE WINDOW
IF 9007 series
* DISPENSING
IF 9002 IF 9007', IF 9008'
* INCREASED SOLDERABILITY
MA 1002
Flux type used Metal content
(standard) Powder size
type available Application
method
IF 9006 90 % 2, 3, 4 and 5 ICT-related issue
IF 9002 88 % 2, 3, 4 and 5 Dispensing
89 - 89,5 % 2, 3, 4 and 5 Screen and stencil printing
IF 9007' 89 - 90 % 2, 3, 4 and 5 Start-stop printing, high tack
84 % 3, 4 and 5 Dispensing
MA 1002 89 % 2, 3, 4 and 5 Screen and stencil printing
IF 9008 86 % 3 Lead-free screen and stencing printing
82 % 3 Lead-free dispensing
To IPC J-STD-005
Type 1 = 75-150µ Type 3 = 25-45µ Type 5 = 15-25µ
Type 2 = 45-57µ Type 4 = 20-38µ
Alloys available Melting point Powder size
type available
sn63Pb37 183o C 2 and 3
Sn62Pb36Ag2 179o C 2, 3, 4 and 5
LEAD-FREE
Sn96Ag4 221o C 3
Sn95.5Ag3.8Cu0.7 217o C 3 (4, 5, 6, 8)
Other alloys are available on request
The flux media is designed to volatilize at reflow temperatures, leaving a minimal, non-tacky, transparent residue on the board taht does not need to be cleaned. The hydrophobic nature minimizes the impact of the humidity in the atmosphere on the chemistry. The solderpaste has an excellent glue effect, no strong smell, no slump and no solderballing. The actiation system allows good welting on pretinned, electroless nockel-gold and copper surface. Different viscositites and packaging available.
